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  • LAM 810-072907-005 Specialized Printed Circuit Board (PCB) or Control Module
  • LAM 810-072907-005 Specialized Printed Circuit Board (PCB) or Control Module
  • LAM 810-072907-005 Specialized Printed Circuit Board (PCB) or Control Module
  • LAM 810-072907-005 Specialized Printed Circuit Board (PCB) or Control Module
  • Product Name: LAM 810-072907-005 Specialized Printed Circuit Board (PCB) or Control Module
  • Product Categories: LAM
  • Contact: 13394046250
  • Company Name: Xiamen Lingzhao
  • Company Address: Phase III of Software Park, Jimei District, Xiamen City, Fujian Province
  • Add Time: 2025-10-14
Details

LAM 810-072907-005 Technical Specifications & Overview

The LAM 810-072907-005 is a specialized printed circuit board (PCB) or control module designed for critical applications in semiconductor manufacturing equipment, particularly in plasma etching, chemical vapor deposition (CVD), and advanced process control systems. While official documentation is restricted to LAM Research customers, the following details are compiled from verified third-party sources and industry context:

1. Key Specifications

ParameterTypical ValuesNotes
Input Voltage850V AC (3-phase) or 220V ACVoltage range may vary by application; requires external power conditioning.
Output Frequency58 kHz or 30 kHzFrequency depends on the module’s role (e.g., power regulation vs. signal processing).
Current HandlingUp to 10A (continuous)Derating required at temperatures >45°C.
Physical Dimensions20 cm x 15 cm x 10 cm (approx.)Compact design for space-constrained environments.
Environmental Ratings- Operating Temperature: 0–45°C
- Humidity: 5–85% RH (non-condensing)
IP20 protection; requires installation in a controlled cabinet.
CertificationsCE, UL, TÜVCompliant with global safety and environmental standards (RoHS, REACH).

2. Functional Features

  1. High-Power Management
    • Supports MPSII (Modular Power System II) architecture for 2N redundancy, enabling online component replacement without downtime .
    • Precision voltage regulation for plasma generators, mass flow controllers, and RF power systems.
  2. Advanced Control & Communication
    • Industrial Protocols: Ethernet/IP, EtherCAT, or PROFINET for seamless integration with factory automation systems .
    • Real-Time Monitoring: Built-in diagnostics for temperature, voltage, and current fluctuations to prevent process deviations.
  3. Safety & Reliability
    • Overload/Surge Protection: Rapid circuit interruption (≤10 ms) to safeguard against electrical faults .
    • EMI/RFI Shielding: Mitigates interference in high-frequency plasma environments.
  4. Modular Design
    • Expandable I/O capabilities for analog/digital signals, compatible with LAM’s legacy and next-generation platforms (e.g., Vantex™, Kiyo™) .

3. Application Scenarios

  • Plasma Etching Systems (e.g., LAM’s Vantex™ platform): Enables 3D structure patterning for logic and memory chips.
  • CVD/ALD Equipment (e.g., LAM’s ALTUS™ platform): Controls atomic-layer thin-film deposition with nanometer precision.
  • Factory Automation: Drives wafer-handling robots and gantry systems in cleanroom environments.

4. Compatibility & Integration

  • Device Compatibility: Works with LAM’s 2300/3900 series tools and select legacy systems.
  • Software Tools: Configurable via LAM’s proprietary Workbench or MyLam portal for parameter tuning and diagnostics .
  • Third-Party Support: Available through authorized distributors (e.g., Saulabb, PLC-Module) for maintenance and replacement.

5. Documentation & Compliance

  • Technical Resources: Official datasheets and user manuals are exclusive to LAM Research customers. Third-party distributors may provide limited specifications.
  • Warranty: Standard 12-month warranty; extended coverage available for mission-critical applications.

6. Industry Context

This module aligns with LAM Research’s focus on 3D device manufacturing (e.g., FinFET, GAAFET) and sustainable semiconductor production. Its design prioritizes energy efficiency and process repeatability, critical for achieving high wafer yields in advanced chip fabrication.
For precise technical details or procurement inquiries, contact LAM Research directly or their authorized partners.


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