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  • NI PXle-8370 High-performance MXI-Express x4 Multisystem Expansion Interface Module
  • NI PXle-8370 High-performance MXI-Express x4 Multisystem Expansion Interface Module
  • NI PXle-8370 High-performance MXI-Express x4 Multisystem Expansion Interface Module
  • NI PXle-8370 High-performance MXI-Express x4 Multisystem Expansion Interface Module
  • NI PXle-8370 High-performance MXI-Express x4 Multisystem Expansion Interface Module
  • NI PXle-8370 High-performance MXI-Express x4 Multisystem Expansion Interface Module
  • Product Name: NI PXle-8370 High-performance MXI-Express x4 Multisystem Expansion Interface Module
  • Product Categories: NI
  • Contact: 13394046250
  • Company Name: Xiamen Lingzhao
  • Company Address: Phase III of Software Park, Jimei District, Xiamen City, Fujian Province
  • Add Time: 2025-10-11
Details

Detailed Information of NI PXIe-8370

The NI PXIe-8370 is a high-performance MXI-Express x4 multisystem expansion interface module designed by National Instruments (NI) for PCI Express, CompactPCI Express, and PXI Express bus systems. Its core function is to enable remote control of PXI and CompactPCI systems, facilitating high-speed data transmission and flexible system expansion in large-scale test and measurement scenarios such as aerospace, automotive electronics, and industrial automation.

1. Basic Information

  • Brand: National Instruments (NI)
  • Model: PXIe-8370
  • Product Series: MXI-Express (Multisystem eXtension Interface Express)
  • Product Type: MXI-Express x4 Expansion Interface Module (for remote control and data transmission of PXI/CompactPCI Express systems)
  • Form Factor: 3U single-slot module; Dimensions: 10.0 × 16.0 cm (3.9 × 6.3 in)
  • Weight: Typical 0.17 kg (0.37 lb)
  • Slot Requirement: Requires 1 system slot (compatible with PXI Express or CompactPCI Express chassis)
  • Life Cycle Status: Active (supported by NI with official technical assistance and maintenance services)
  • Software Compatibility: Compatible with NI Measurement & Automation Explorer (MAX) for configuration; integrates with LabVIEW, LabWindows/CVI, and C/C++ development environments; transparent to device drivers (no additional software required to support PXI Express devices in connected chassis).

2. Electrical & Performance Specifications

CategoryDetails
Power Requirements- +3.3V power rail: Typical current 2.5A, maximum current 3A
- +5V power rail: Typical current 0A, maximum current 5mA
- +12V power rail: Typical current 0A, maximum current 1mA
- +5V_AUX power rail: Typical current 300mA, maximum current 400mA
Data Transfer RateBased on MXI-Express x4 technology; theoretical bidirectional link bandwidth up to 40 Gbps
Connection MediaWorks with standard copper MXI-Express x1 cables (for connecting to interface boards like the PCIe-8371)
Bus ComplianceFully compliant with PXI Express Hardware Specification Revision 1.0 and PICMG CompactPCI Express EXP.0 Revision 1.0
SynchronizationSupports system-wide timing synchronization via PXI Express backplane triggers and 10 MHz reference clocks

3. Functional Features

3.1 Transparent System Connectivity

The module uses a fully transparent MXI-Express link, allowing a host PC to control PXI and CompactPCI systems without modifying existing device drivers. Connected PXI Express devices in the chassis are recognized as "local" to the host, eliminating the need for custom software development and ensuring seamless compatibility with legacy test workflows.

3.2 High-Speed & Reliable Data Transmission

With MXI-Express x4 technology, it delivers a theoretical bidirectional bandwidth of 40 Gbps, enabling real-time transfer of large-volume test data (e.g., high-speed sensor signals, waveform data). Built-in error detection and retransmission mechanisms ensure zero data loss, critical for precision-dependent applications like aerospace component testing.

3.3 Broad Compatibility

It adheres to industry standards for PXI Express and CompactPCI Express, supporting interoperability with a wide range of NI and third-party PXI/CompactPCI Express modules (e.g., data acquisition cards, signal generators, and digitizers). This flexibility makes it ideal for upgrading or expanding existing test systems.

3.4 Rugged Industrial Design

  • Temperature Tolerance: Operates reliably in 0°C to 55°C (32°F to 131°F) environments, meeting MIL-PRF-28800F Class 3 low-temperature limits and Class 2 high-temperature limits (tested per IEC-60068-2-1 and IEC-60068-2-2).
  • Environmental Resilience: Withstands 10% to 90% non-condensing relative humidity (tested per IEC-60068-2-56) and supports operation at altitudes up to 2000 m (800 mbar) at 25°C.

4. Operating Environment

  • Operating Temperature: 0°C to 55°C (32°F to 131°F)
  • Storage Temperature: -40°C to 71°C (-4°F to 160°F) (meets MIL-PRF-28800F Class 3 limits, tested per IEC-60068-2-1 and IEC-60068-2-2)
  • Relative Humidity: 10% to 90% (non-condensing, tested per IEC-60068-2-56)
  • Altitude: Maximum 2000 m (800 mbar) at 25°C

5. Typical Application Fields

  • Aerospace & Defense Testing: Enables remote control of PXI-based data acquisition systems in harsh environments (e.g., wind tunnel tests, engine performance monitoring), keeping host PCs in safe, controlled spaces.
  • Automotive Electronics ATE: Expands test systems to support multi-channel ECU (Electronic Control Unit) testing, with high-speed data transmission for real-time analysis of sensor and actuator signals.
  • Industrial Automation: Connects distributed PXI/CompactPCI Express systems for unified monitoring and control of manufacturing processes (e.g., semiconductor equipment, power grid testing).
  • Laboratory R&D: Facilitates flexible integration of PXI modules (e.g., signal analyzers, arbitrary waveform generators) into a single controlled system, simplifying complex experiment setups.


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